Tekmos Unify Brochure Ready for Conference

This month we have published our brochure describing Unify ASICs for the IoT.

System engineers need to meet the challenges of smaller physical packaging, lower power consumption and better connectivity solutions that offer fast time to market. The Unify - ASICs Brochure describes capabilities and approaches of how Unify ASICs achieve smaller space with low power by using standard parts combined with our low risk Unify ASIC. The Unify ASIC features a silicon interconnect combined with integration of logic and mixed signal technologies by Tekmos for better connectivity solutions.

The Unify ASIC designed by Tekmos for the customer, provides a breakthrough approach offering the lowest development cost for a System in a Package solution for new products. The Unify ASIC includes design security making it extremely difficult for others to copy a customer's product design. Unify ASICs protect market share and allow the customer to maintain higher selling prices over the life of their product.

Tekmos will be an exhibitor at the upcoming IoT Developers Conference in Santa Clara, May 25-26. We will be located in the exhibit area and look forward to your stopping by to see how Unify ASICs can improve your product developments.

The month of May seems to be a great time for many conferences this year. Tekmos is a major sponsor and exhibitor at the upcoming IMAPS HiTEC High Temperature device conference in Albuquerque, New Mexico, May 10-12. Tekmos will be featuring our high temperature microprocessors, memory devices and ASICs, with ASICs able to operate up to 300ºC. We look forward to presenting our latest product offering for high temperature applications ranging from 175ºC to 300ºC. Please visit us in the exhibit area and learn more about our high temperature microprocessors and ASICs with long lasting operational life.