MIL-STD-883 Compliance

The purpose of this test is to check the internal materials, construction, and workmanship of microcircuits for compliance with the requirements of the applicable acquisition document. This test will normally be used prior to capping or encapsulation on a 100 percent inspection basis to detect and eliminate devices with internal defects, that could lead to device failure in normal applications.

The purpose of this test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes.

The Constant Acceleration Test is a test performed to determine the effects of constant acceleration on semiconductor devices. Mil-Std-883 Method 2001 is the most widely-used industry standard for performing this test.

Constant acceleration testing is designed specifically to uncover structural and mechanical weaknesses in the semiconductor package that are not necessarily detectable by other mechanical stress tests, such as the mechanical shock test and the vibration test.

Burn-in is an accepted practice for detecting early failures for semiconductor devices. It usually requires the electrical testing of a product, using an expected operating electrical cycle (extreme of operating condition), typically over a time period of 48-168 hours.

The Burn-In Method 1015 test is performed for 160 hours at a minimum value of 125°C for the purpose of screening or eliminating marginal devices, those with inherent defects or defects resulting from manufacturing aberrations which cause time and stress dependent failures.

The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the final electrical test in accordance with method 5004 of MIL-STD-883.

The Final Electrical testing assures that the microcircuits tested meet the electrical requirements of the applicable device specification of Group A and Subgroups 1, 2, 3, 4 or 7, 5 and 6, or 8, and 9.

Fine and Gross Leak Method is used to determine the effectiveness of the seal in microelectronic component packages. If the package seal is damaged or defective, moisture and other contaminants can enter into the package freely and degrade the long-term reliability.

This method establishes qualification and quality conformance inspection procedures for microelectronic devices to assure that the device and lot quality conforms with the requirements of the ASIC.

External Visual Method is to verify the workmanship of hermetically packaged devices. This test method shall also be utilized to inspect for damage due to handling, assembly, and testing of the packaged device.