Unify Graphics

The concept behind a Unify SiP (System in a Package) is to stack die within a package using a Tekmos ASIC to include additional functionality and resolve testing and interconnect issues. Because this is a new approach to high density circuits, many are unaware of the details. This requires us to explain it through brochures and other marketing material.

Tekmos New SIP Business Card

The first step is to create a drawing that shows how everything fits together. We normally allow our outside artists considerable leeway in how they do our graphics. But in this case, we had to get it to be technically right. We asked our artist to draw a 4 chip Unify SiP, with our ASIC, a processor that was attached via flip-chip, an RF chip, and topped off with a MEMS. You can see the completed artwork below. We are going to use the artwork in a Unify brochure, on a business card sized brochure with a real chip for reference, and on our trade show booth.

Normally, images are drawn, which makes them hard to modify. We also asked our designer to create this image using 3-D Adobe software. This allowed us to make multiple changes in how the die were stacked and the relative sizes of the die. And it leaves the door open to future efforts to animate the drawing so that we can show how the die go together. We plan for the animation to be in the form of an animated GIF for the web, an animated PowerPoint slide, and perhaps a short video. And that's the background on our new Unify artwork.