High Temperature Microprocessor Strategy

Tekmos is developing a high temperature microprocessor designed to run at 250ºC, using a SOI process. The development has taken longer than planned due to custom design issues with the SOI process. As a result, we decided to split the project into a SOI version and a bulk silicon version, and make the initial silicon on a 0.6u bulk process. This will allow us to characterize the processor design and verify its functionality. And there is a market demand for parts in that temperature range.

This 0.6u process works well at temperatures up to 210ºC, and we have a lot of high temperature experience with designs that use this process. One of our 0.6u gate arrays has 2K bytes of EEPROM on it as well as an 8-bit ADC and 1K of RAM. These are useful components for a microcontroller, and incorporated them into our 8051 design.

We have been using a "H" designator for the 8051 series to indicate high temperature. But now that we have both bulk and SOI parts underway, we find it necessary to create new part numbers. In the past, other 8051 vendors have differentiated their parts with a suffix, and so we followed that procedure. Here is our new numbering system for the 0.6u, high temperature 8051s:

We have incorporated these numbers into a new data sheet, which is available on our web site.

Date

2015-12-17