Test Floor Production Manager

Adrian DeLeon is the Post Manufacturing Test Floor Manager for Tekmos, a highly focused, and challenging leadership position in an often-fast paced environment. He is accountable for managing communications with test floor crew, production, customer service, and operations of schedules and systems that guarantee inventory control, finished goods, shipping of products, and an overall effective and efficient production flow.

2020 is his 6th year at Tekmos. Adrian was sought out by the Vice President of Operations after meeting at one of the elite trainings the Boy Scouts of America has to offer, the Wood Badge. Adrian is an Eagle Scout, the highest rank in Boy Scouts of America, a distinction that several Tekmos Team members hold including President Lynn Reed. Adrian has also earned every merit badge, an accomplishment in itself. Only 4% of Boy Scouts have achieved this rank since its inception in 1911.

Some of the priorities of the test floor include: Managing and ensuring safe, quality test floor operations for the testing and programming of various semiconductors, microcontrollers and microchips. Other priorities include the enforcement and maintenance of quality control and environmental industry-respected best practices to meet customer, and applicable regulatory requirements.

Tekmos uses several types of machines needed in Fabless facilities, such as hot and cold temperature forcing probes, bake ovens, gravity-fed MCTs, an automatic multitester, a pick-and-place Aetrium, V-Tek Tape & Reel machines, and the newest machine, the Exatron pick-and-place handler.

Tekmos uses ATEs to reduce manufacturing costs, improve yield, and specifically to prevent defective devices ending up with consumers. Tape and reel equipment as the name implies, is the equipment used in packing and sealing finished products into individual pockets of a carrier tape, and in rolling this tape onto a reel. Tekmos uses tape and reel when a customer requires it as well as for large quantity part orders. Taping and reeling is an alternative packaging process for small surface mount devices that are impractical to ship in tubes. Tekmos ships parts in tubes, tape and reel and other packaging when required.

An average day will consist of receiving new orders and systematically organizing it into the test floor process flow. At the same time machines are continued running processing chips and completed orders are prepared for outbound shipments. Meeting customer ship dates is a daily process that the test floor strives to achieve.

Adrian takes great pride in his management of Tekmos' Test floor. He holds a BA in Business Administration from St. Edward’s University in Austin, Texas.